The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing. Achieving uniform thermal stress and outstanding temperature distribution performances, the 100L test area fits for a wide range of applications in the research and development, inspection or production field.
Meeting International Standards
The TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS.
Reduced power consumption
Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%.
Specifications
Model
Temperature range
Inside / Outside dimensions （mm）
TSD-100
High temp. exposure: +60 to +200°C [+140 to +392°F] Low temp. exposure: -65 to 0°C [-85 to +32°F]
W710xH345xD410 / W1100xH1885xD1965
Features
Short temperature recovery time The two temperature zone system achieves quick specimen temperature recovery time （less than 15 min. for 10kg of ICs, at extreme temperature exposure）.
Excellent temperature uniformity ESPEC improved its chamber temperature uniformity of 30% compared to previous model, thus leading to minimum variations among specimens, and more reliable test results.
STT function （Specimen Temperature Trigger） The TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy.
Ambient temperature recovery feature Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely.
Specimen temperature recovery （example） （based on MIL-883 condition C）
Test conditions High temp. exposure: +155°C for 30 min. Low temp. exposure: -68°C for 30 min. Specimens: ICs, 10 kg
Temperature uniformity measurement method Thermocouples were embedded in 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. （Specimens with embedded thermocouples were placed beneath other ICs.）
Temperature uniformity performance （example）
Test conditions High temp. exposure: +150°C for 30 min. Low temp. exposure: -65°C for 30 min. Specimens: ICs （×10）
Temperature uniformity measurement method Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket.
Test time comparison （example）
Test conditions High temp. exposure: +150°C, 15 min. after recovery Low temp. exposure: -65°C, 15 min. after recovery Specimens: ICs, 10kg Control points: Upstream of sensor positions
Measurements Test time reductions of approximay 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximay 1 month.
Tset Standards
Compatible test standards
IEC 60749-25 : Semiconductor devices – Temperature cycling IEC 60068-2-14 Na : Environmental testing – Change of temperature IEC 61747-5 Na : Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods MIL-STD-202G : Test method standard – Electronic and electrical component parts MIL-STD-883F : Military standard, microcircuits, test standards IPC-TM-650 2.6.6 : Temperature cycling, printed wiring board SAE J1879 : Handbook for robustness validation of semiconductor devices in automotive applications JASO-D001 : General rules of environmental testing methods for automotive electronic equipment JASO-D902 : Durability testing methods for automotive electronic equipment EIAJ ED-4701 : Environmental and endurance test methods for semiconductor devices. （General） EIAJ ED-4702 : Mechanical stress test methods for semiconductor surface mounting devices EIAJ ED-7407 : Environmental and endurance test methods for CSP, BGA package on mounting condition
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