產(chǎn)品特性(Product characteristics):

    二氧化硅拋光片，將0.02微米顆粒涂布于3mil精密PET帶基上，作為光纖研磨終端拋光。
Silicon dioxide polishing wafer, the 0.02 micron particles are coated on the 3mil precision PET band, as the optical fiber polishing polishing terminal.

    產(chǎn)品規(guī)格：圓盤型: 直徑127mm (5")

    長方型: 113mm X 140mm   

    使用基材：厚度為3mil(75um)聚酯薄膜

    Use of substrate: the thickness of 3mil (75um) polyester film.

    研磨工藝建議(Grinding process suggestion):

    研磨前應(yīng)先將拋光片保持充份濕潤, 并且保持研磨還境潔凈，在每盤拋光完成后, 確實(shí)地清洗拋光片,可保持拋光片處于良好的拋光效能使拋光片得延長其使用壽命。

    Before grinding should first polishing pads to keep sufficient moist, and keep grinding environment clean, in after the completion of each disc polishing, actually cleaning polishing pad can keep polishing plate is in a good polishing performance enable polishing slice to prolong its service life.