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ES640 Charged Device Model (CDM) Test System

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更新時(shí)間：2024-08-21 11:16:00瀏覽次數(shù)：182次

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ES640 Charged Device Model (CDM) Test System
Charged Device Model (CDM) electrostatic discharge is a common cause of microelectronic circuit failure.

ES640 Charged Device Model (CDM) Test System

1.    Introduction

Charged Device Model (CDM) electrostatic discharge is a common cause of microelectronic circuit failure. Sensitive devices can be seriously damaged or destroyed by a CDM discharge at relatively low voltage. This often occurs when the static charged device contacts a metal surface at a different potential. Such an electrostatic discharge often has an extremely fast rise time.

The Model ES640 is a robotic CDM (Charged Device Model) tester designed to meet all popular CDM ESD test methods, allowing both field induced air discharge methods (FICDM) and relay based contact discharge methods (LI-CCDM, CC-TLP, RP-CCDM). The system includes a computer, environment-controlled chamber, precision XYZ motion system, different types of CDM tester modules, and an automated test and data analysis software.

Here is a comparison between ESDEMC ES640 CDM Solution to others, including Thermo Scientific Orion3 CDM tester .

2.    Features

  • High resolution cameras (up to 3) allow for easy pin alignment operation

  • High resolution motion control system (down to 1 µm step)

  • Allows multiple devices being tested in a batch

  • Patent-pending CCDM method allows better repeatability

  • Airtight environment chamber increases drying unit efficiency

  • Support regenerative drying unit (no need of nitrogen)

3.    Applications

  • General charged device model (CDM) system for package and wafer level tests

  • Support many popular latest CDM methods:

    • ANSI/ESDA/JEDEC JS-002 (FICDM)

    • AEC Q100-011 Rev-D (2019 Ver. follows JS-002)

    • AEC Q101-005 Rev-A (2019 Ver. follows JS-002)

    • ANSI/ESD SP5.3.3 (LI-CCDM, vf-TLP required)

    • CC-TLP (ESDA SP pending, vf-TLP required)

    • Patent pending RP-CCDM method

    • Legacy and customized solutions available upon request

  • Customizable dimension for robotic CBM (Charged Board Model) and flat panel ESD test

4.    Specifications

 

Parameters ES640-150 ES640-300 Units Comments
Max XY Motion Area ≥ 150 X 150 ≥ 300 X 300 mm Probe motion area, customizable
Max DUT Area 160 X 160 375 X 425 mm MAX Field plate area for DUT
Field Plate Area 210 X 210 395 X 470 mm Field plate area
Z Travel ≥ 50 mm  
Min X, Y, Z Step Size 100 nm  
Reposition Repeatability ≤ ±6 μm  
Test Voltage Range ±1 to 2000 or 4000 V Default 2000V, customizable
Test Voltage Step 1 V  
Test Voltage Accuracy ± 1% ± 0.1V %  V  
XY Vision Resolution 1920 X 1080 Pixel  
Vertical Vision Resolution 2592 X 1944 Pixel  
Operating Temperature 10 to 40 (°C)  
Operating Humidity (RH) 0 to 80 %  
Power 120-240 VAC, 50/60 Hz VAC  
N2 or CDA Pressure 10 – 120 PSI  
N2 or CDA Peak Usage 0.2 cfm (or 0.34 m3h)
300 N2 Tank Avg Usage ~ 19 hour Continuous @ 40RH environment
Desiccant Avg Usage ~ 24 hour Continuous @ 40RH environment

 

5.    Ordering Information

ES640 Charged Device Model (CDM) Test System

Line Part # or Option # Description
ES640 Charged Device Model (CDM) Test System
1.1 ES640-150 Universal CDM platform, 150 X 150 mm Test Area, 2 kV
1.2 ES640-300 Universal CDM platform, 300 X 300 mm Test Area, 2 kV
1.3 ES640-HC Humidity Conditioning Unit for Air Discharge Methods
(Uses reusable desiccants, lower cost of usage than N2 or CDA)
1.4 ES640-CV4 Charge Voltage Upgrade from 2kV to 4 kV
ANSI/ESDA/JEDEC JS-002 Standard Related Test Solution (Followed standards include AEC_Q100-011D, AEC_Q101-005A)
2.1 ES640-JS002 JS-002 Solution – System Integration Package (Including One ES640-JS002-1 Test Fixture)
2.2 ES640-JS002-C JS002/C101 Calibration Disc (6.8 pF and 55 pF)
2.3 ES640-JS002-1 JS-002 Test Fixture #1 (Discharge Tip 250 µm, body diameter 350 µm)
2.4 ES640-JS002-2 JS-002 Test Fixture #2 (Discharge Tip 120 µm, body diameter 200 µm)
ANSI/ESD S5.3.1-2009 Standard Related Solution (Not recommend for new designs)
3.1 ES640-S09-F ANSI/ESD S5.3.1-2009_FI-CDM Discharge Unit
3.2 ES640-S09-D ANSI/ESD S5.3.1-2009_D-CDM Discharge Unit
3.3 ES640-S09-C ANSI/ESD FR4 Calibration Module (4 and 30 pF)
3.4 ES640-J13 JEDEC-JESD22-C101F-2013 FI-CDM Discharge Unit
RP-CCDM Contact First CDM Solutions (New methods for discharge stability improvements, not standardized yet)
4.1 ES640-RPCCDM ESDEMC Patented Contact First CDM Solution

 

(Very repeatable contact first method, meets JS002 requirement, not require VF-TLP)

(Including one ES640-PRCCDM-P1 Discharge Unit)
4.2 ES640-RPCCDM-P1 RP-CCDM Discharge Unit for Packaged Device
4.3 ES640-RPCCDM-W1 RP-CCDM Discharge Unit for Bare-die & Wafer Device
LI-CCDM Contact First CDM solution
5.1 ES640-LICCDM LI-CCDM Discharge Solution – System Integration Package
(Including one ES640-LICCDM -P1 Discharge unit, require VF-TLP)
5.2 ES640-LICCDM-P1 LI-CCDM Discharge Unit for Packaged Device
5.3 ES640-LICCDM-W1 LI-CCDM Discharge Unit for Bare-die & Wafer Device
5.4 ES640-vfTLP VF-TLP module for CC-TLP or LI-CCDM Method
(This VF-TLP module is a compact VF-TLP for the ES640 system. The default configuration is 1 rise-time + 1 pulse-width with limited expansion capability. If more pulse shape options are needed, model ES622 TLP/VF-TLP is the best option)
CC-TLP Solution
6.1 ES640-CCTLP CC-TLP Solution – System Integration Package
(Including 1 set of ES640-CCTLP-1-50 & calibration gauge)
6.2 CC-TLP-1-50 CC-TLP Discharge Unit with 50m OD GND Plate
6.3 CC-TLP-1-100 CC-TLP Discharge Unit with 100m OD GND Plate
6.4 CC-TLP-1-Cal CC-TLP calibration gauge for needle height
Third Party Instruments for CDM System
7.1 MISC-OSC2G Digital Oscilloscope (2 GHz, 20 Gs)
7.2 MISC-OSC6G Digital Oscilloscope (6 GHz, 20 Gs) 

ES640 Charged Device Model (CDM) Test System

 

 

 

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