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Helios 5 Laser PFIB System

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Helios 5 Laser聚焦離子束PFIB System

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       賽默飛世爾科技賽默飛世爾科技(紐約證交所代碼:TMO)是科學(xué)服務(wù)領(lǐng)域的世界領(lǐng)導(dǎo)者。公司年銷售額超過250億美元。在全球擁有約70,000名員工。我們的使命是攜手客戶,讓世界更健康、更清潔、更安全。我們幫助客戶加速生命科學(xué)領(lǐng)域的研究、解決在分析領(lǐng)域所遇到的復(fù)雜問題與挑戰(zhàn),促進(jìn)醫(yī)療診斷發(fā)展、加速藥物上市進(jìn)程、提高實(shí)驗(yàn)室生產(chǎn)力。我們?nèi)虺^75,000名賽默飛員工將借助于一系列行業(yè)領(lǐng)先的品牌Thermo Scientific、Applied Biosystems、Invitrogen、Fisher Scientific、Unity Lab Services和Patheon,為客戶提供另想的創(chuàng)新技術(shù)、便捷采購方案和全方位服務(wù)。

      欲了解更多信息,請瀏覽公司網(wǎng)站:www.thermofisher.com 賽默飛世爾科技中國簡介賽默飛世爾科技進(jìn)入中國發(fā)展已超過35年,在中國的總部設(shè)于上海,并在北京、廣州、香港、成都、沈陽、西安、南京、武漢、昆明等地設(shè)立了分公司,員工人數(shù)約為5000名。我們的產(chǎn)品主要包括分析儀器、實(shí)驗(yàn)室設(shè)備、試劑、耗材和軟件等,提供實(shí)驗(yàn)室綜合解決方案,為各行各業(yè)的客戶服務(wù)。為了滿足中國市場的需求,現(xiàn)有7家工廠分別在上海、北京、蘇州和廣州等地運(yùn)營。我們在全國還設(shè)立了8個應(yīng)用開發(fā)中心以及示范實(shí)驗(yàn)室,將世界級的前沿技術(shù)和產(chǎn)品帶給中國客戶,并提供應(yīng)用開發(fā)與培訓(xùn)等多項(xiàng)服務(wù);擁位于上海的中國創(chuàng)新中心,擁有有100多位專業(yè)研究人員和工程師及70多項(xiàng)專利。創(chuàng)新中心專注于針對垂直市場的產(chǎn)品研究和開發(fā),結(jié)合中國市場的需求和國外先進(jìn)技術(shù),研發(fā)適合中國的技術(shù)和產(chǎn)品;我們擁有遍布全國的維修服務(wù)網(wǎng)點(diǎn)和特別成立的中國技術(shù)培訓(xùn)團(tuán)隊(duì),在全國有超過2600名專業(yè)人員直接為客戶提供服務(wù)。我們致力于幫助客戶使世界更健康、更清潔、更安全。

      欲了解更多信息,請登錄網(wǎng)站:www.thermofisher.com 全國服務(wù)熱線:021-61621892公司電子郵箱:sales.china@thermofisher.com

科學(xué)儀器

Helios 5 Laser PFIB System

FIB SEM laser tool for high throughput millimeter scale cross sectioning and 3D characterization with nanometer resolution

The Thermo Scientific Helios 5 Laser PFIB System combines the best-in-class monochromated Elstar Scanning Electron Microscopy (SEM) Column with a plasma focused ion beam (PFIB) and a femtosecond laser to produce a high-resolution imaging and analysis tool with in-situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.

Key Features


Fast material removal

Millimeter-scale cross sections with up to 15,000x faster material removal than a typical gallium focused ion beam.

Accurate and repeatable cut placement

The same coincident point for all 3 beams (SEM/PFIB/laser) enables accurate and repeatable cut placement and 3D characterization.

High throughput processing of challenging materials

Includes non-conductive or ion-beam-sensitive samples.

Shares all capabilities of the Helios 5 PFIB platform

High-quality gallium-free TEM and APT sample preparation and high-resolution imaging capabilities.

Statistically relevant subsurface and 3D data analysis

Acquire data for much larger volumes within a shorter amount of time.

Fast characterization of deep subsurface features

Extraction of subsurface TEM lamella or chunks for 3D analysis.

Fast and easy characterization of air-sensitive samples

No need to transfer samples between different instruments for imaging and cross-sectioning.

Specifications

Femtosecond-laser specifications
Laser integration
  • Fully integrated in the chamber with the same coincident point for all 3 beams (SEM/PFIB/laser), enabling accurate and repeatable cut placement and 3D characterization.

Laser Output
First Harmonic
  • Wavelength

1030 nm (IR)


  • Pulse duration

<280 fs

Second Harmonic
  • Wavelength

515 nm (green)


  • Pulse duration

<300 fs

Optics
Coincident point
  • Working distance= 4 mm (Same as SEM/FIB)

Objective lens
  • Variable (motorized)

Polarization
  • Horizontal/vertical

Repetition rate
  • 1 kHz – 1 MHz

Position accuracy
  • <250 nm

Protective shutter
  • Automated SEM/PFIB protective shutter

Software
  • Laser control software

  • Laser 3D serial sectioning workflow

  • Laser 3D serial sectioning workflow with EBSD

  • Laser scripting with optional Thermo Scientific AutoScript 4 Software

Safety
  • Interlocked laser enclosure (Class 1 laser safety)




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